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Highly conductive thermoplastic: Shows promise in 3D-Printed Circuits Machine Design

By: Machine Design
Subject(s): Circuitos impresos | Impresión 3D | Impresoras 3D | Materiales termoplásticos In: Machine Design Vol.87, No.7, 2015: página 22Abstract: A revolution in 3D-printed circuitry could be in the making if scientists at the Institute of Materials Research and Engineering (IMRE) at the Agency for Science, Technology and Research (A*STAR) have their way. The team created a new thermoplastic filament with a resistance of 0.5-1.0 Ω-cm-1000 times more conductive than commercial thermoplastic used in 3D-printed circuits. The material is a blend of carbon powder and polypropylene that's extruded as filaments. It's able to withstand loading and high temperatures during 3D printing in standard thermoplastic 3D printers. It also can be used as a solder, as it sticks well to other thermoplastic materials. It has virtually uniform conductivity, with less than 5% variation.
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Holdings: Machine Design Vol.87, No.7, 2015: página 22

A revolution in 3D-printed circuitry could be in the making if scientists at the Institute of Materials Research and Engineering (IMRE) at the Agency for Science, Technology and Research (A*STAR) have their way. The team created a new thermoplastic filament with a resistance of 0.5-1.0 Ω-cm-1000 times more conductive than commercial thermoplastic used in 3D-printed circuits. The material is a blend of carbon powder and polypropylene that's extruded as filaments. It's able to withstand loading and high temperatures during 3D printing in standard thermoplastic 3D printers. It also can be used as a solder, as it sticks well to other thermoplastic materials. It has virtually uniform conductivity, with less than 5% variation.

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